量产服务
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01封装设计服务

Provides package and substrate layout design, including QFN/QFP, BGA to FCBGA (Flip Chip), MCP.

02测试服务

Covers CP/FT hardware design and manufacturing, test program development, and production test management.

03产品工程服务

Supports yield analysis, improvement, and stable mass production ramp-up.

04品质与可靠度服务

Provides reliability and qualification testing at both component and board levels, in compliance with JESD and IPC standards.

05供应链管理服务

Partners with top-tier suppliers to ensure sufficient and flexible production capacity throughout the supply chain.