Production Service
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01Package Design Services

Provides package and substrate layout design, including QFN/QFP, BGA to FCBGA (Flip Chip), MCP.

02Testing Services

Covers CP/FT hardware design and manufacturing, test program development, and production test management.

03Product Engineering Services

Supports yield analysis, improvement, and stable mass production ramp-up.

04Quality & Reliability Services

Provides reliability and qualification testing at both component and board levels, in compliance with JESD and IPC standards.

05Supply Chain Management Services

Partners with top-tier suppliers to ensure sufficient and flexible production capacity throughout the supply chain.